Samsung has announced a new technology called eXtended-Cube (X-Cube), a silicon-proven 3D integrated circuit (IC) packaging technology that enables 3D SRAM-logic silicon at 7-nanometres and beyond.
Samsung has pushed forward with another industry-first, applying a 3D stacking to a 7nm EUV system chips. Dubbed X-Cube, the concept is at once complex and straightforward. In effect, Samsung has ...
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