The push toward more complex integration in chips, advanced packaging, and the use of those chips for new applications is turning the test world upside down. Most people think of test as a single ...

1. The OSD335x is an example of a complete system fitting into a tiny BGA package. We also discussed the advantages SiP brings to the design and manufacturing of semiconductors and how they can be ...

Our second C-Brief discusses where system-level test (SLT) best fits into your semiconductor test workflow. With automated testing equipment (ATE), a traditional workflow may consist of: Wafer sort ...

In a virtual environment, the options for recovery can be divided into four main sections. Hardware-based replication provides a well-established process to implement a disaster recovery strategy.