The shift toward more complex IC packages requires more advanced inspection systems in the production flow to capture unwanted defects in products. This includes traditional optical inspection tools ...
IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...
How much can one package take? As consumer electronics design features scale down to 45-nm and even 32-nm nodes, IC makers are pushed to the limits to shoehorn more functionality into these packages- ...
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