3D Interconnect Designer simplifies high-speed 3D interconnect design for silicon bridges and interposers. As chiplet architectures are increasingly adopted, engineers face complex 3D interconnect ...
Abstract: For the next generation memory devices such as 3D-NAND involving copper-to-copper (C2C) hybrid bonding process, chemical mechanical planarization (CMP) process is a vital step to provide ...
Abstract: This paper presents a methodology to help prevent overdesign of Electrostatic Discharge (ESD) protection circuits for internal I/O in 2.5D/3D bonding technologies. We explore how the voltage ...
This project implements state-of-the-art 3D object detection models for LiDAR point cloud data, including PointPillars, SECOND, and CenterPoint architectures. It provides a complete pipeline from data ...
With the advance of technology and more specifically mobile technology, drawing has taken unprecedented dimensions empowering kids to take their creative skills to the next level. There are now a wide ...
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