JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.
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OpenAI solves the stack memory problem
For years, software stacks kept getting more complex. OpenAI is moving in the opposite direction. This video breaks down how AI is collapsing layers that used to be mandatory. The impact affects ...
At the SK AI Summit 2025 in Seoul on November 3, 2025, SK Hynix CEO Kwak Noh-jung announced a major strategic overhaul, revealing plans to transform the South Korean memory maker from a traditional ...
Apple launched a slate of new iPhones on Tuesday loaded with the company's new A19 and A19 Pro chips. Along with an ultrathin iPhone Air and other redesigns, the new phones come with a less flashy ...
High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...
Recent progress on deep learning accelerators enabled impressive performance on a wide range of applications. However, deep learning accelerators consume enormous amount of energy when accelerated in ...
A Q and A on Lam Research technology solutions designed to address the AI-fueled demand for High Bandwidth Memory. Philip Alsop speaks with with Aaron Fellis, corporate vice president and general ...
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